Apple Silicon supplier TSMC breaks ground on €10 billion plant in Dresden, Germany
Taiwan Semiconductor Manufacturing Company (TSMC) broke ground in Dresden, Germany as it builds its first European plant amid growing U..S-China tensions.
Kamil Kowalcze for Bloomberg:
“We are dependent on semiconductors for our sustainable future technologies, but we must not be dependent on other regions of the world for the supply of semiconductors,” said German Chancellor Olaf Scholz, who attended a ceremony on Tuesday to mark the start of construction of the €10 billion ($11 billion) fab in the city of Dresden. About half of the funding will be covered by state subsidies.
Germany is leading the European Union push to produce one-fifth of the world’s semiconductors by 2030, with the bloc seeking to build up capacity following Covid-era disruptions and as the relationship between Washington and Beijing deteriorates. The US, Japan and others are also showering subsidies on the chip industry to localize production of the components that control everything from cutting-edge artificial intelligence to everyday gadgets.
TSMC is the world’s biggest contract chipmaker, with Apple Inc. and Nvidia Corp. relying on it for their most important products. It will anchor the Dresden project with a 70% stake in the plant, which will produce chips for the automotive and industrial sectors…
Tensions over Taiwan, where the bulk of TSMC’s production is based, have contributed to the company’s expansion abroad. Beijing considers Taiwan a part of its territory, and an economic blockade or conflict over the island would massively disrupt the global supply chain.
This year TSMC opened its first plant in Japan and it has pledged to build three advanced plants in the US state of Arizona with total investments exceeding $65 billion.
MacDailyNews Take: When it comes to critical production: Diversify, diversify, diversify!
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