Apple’s A18 chip is unique design, not a ‘binned’ A18 Pro
Die shots of the A18 (left) and the A18 Pro [images: Chipwise]
New microphotographs have shed light on the internal workings of the A18 and A18 Pro chips powering the iPhone 16 lineup. These images confirm that Apple is not using chip binning with the A18 lineup, a process that involves sorting chips based on their performance.
Following teardowns of the iPhone 16, the next logical step was to closely examine the chips themselves. Chipwise has taken on this task, publishing detailed photographs of the dies used in the A18 and A18 Pro.
Malcolm Owen for AppleInsider:
The packaging of the chip has been consistent over the years, with TSMC using an Integrated Fan-Out Package-on-Package (InFO-PoP) method for a while. The technique stacks a DRAM package on top of the SoC die, with high-density redistribution layers and a Through InFO Via assisting to create a compact overall chip size.
In other words, Apple stacks the memory on top of the CPU and GPU, instead of having them in a separate die.
Checking over the die shot for the A18 Pro, it does at first glance appear to be very similar to the A18’s version… However, a more careful examination shows that Apple has included a lot more transistors on the A18 Pro. Many of the lighter sections take up a lot more space on the die compared to what’s on the A18.
MacDailyNews Take: Chip binning is for losers!
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